The semiconductor manufacturing process begins with the production of silicon wafers.
Semiconductors are an ever-present element in modern technology. When judged on their ability to conduct electricity, these devices fall somewhere between full conductors and insulators. They are used as part of a digital circuit in computers, radios, telephones, and other equipment.
The semiconductor manufacturing process begins with the base material. Semiconductors can be made from a dozen of these materials, including germanium, gallium arsenide, and various indium compounds, such as indium antimonide and indium phosphide. The most popular base material is silicon due to its low production cost, simple processing, and temperature range.
After the semiconductor manufacturing process is complete, the finished semiconductors are thoroughly tested.
Using silicon as an example, the semiconductor manufacturing process begins with the production of silicon wafers. First, the silicon is cut into round wafers with a diamond-tipped saw. These wafers are then graded by thickness and checked for damage. Then one side of the wafer is etched with a chemical and polished as smooth as a mirror to remove all impurities and damage. The tiles are built on the smooth side.
Cell phones, laptops, and other devices are based on silicon semiconductors.
A layer of silicon dioxide glass is applied to the polished side of the silicon wafer. This layer does not conduct electricity, but it helps prepare the material for photolithography. The manufacturing process also applies layers of circuit patterns to the wafer after coating it with a layer of photoresist, a light-sensitive chemical. The light is then projected through a grating and lens mask so that the desired circuit pattern is printed onto the wafer.
The photoresist pattern is removed by washing with a series of mixed organic solvents in a process called incineration. The process results in a three-dimensional (3D) wafer. The wafer is then washed with acidic wet chemicals to remove any contaminants and residue. Multiple layers can be added by repeating the entire photolithography process.
Once the layers have been added, areas of the silicon wafer are exposed to chemicals to make them less conductive. This is achieved by using dopant atoms to displace the silicon atoms in the original wafer structure. It is difficult to control how many dopant atoms are deployed in an area.
The final task in the semiconductor manufacturing process is to coat the entire surface of the wafer with a thin layer of conductive metal. Copper is generally used. The metal layer is then polished to remove unwanted chemicals. After the semiconductor manufacturing process is complete, the finished semiconductors are thoroughly tested.