Wafer-level packaging differs from conventional manufacturing in the way the packaging is applied.
Wafer-level packaging refers to the fabrication of integrated circuits by applying packaging around each circuit before the wafer they are made on is separated into individual circuits. This technique quickly grew in popularity in the integrated circuit industry due to advantages in component size as well as production time and cost. A component made in this way is considered a type of chip-scale package. This means that its size is almost equal to that of the matrix inside it, in which the electronic circuit is located.
Wafer-level packaging has allowed mobile phones, tablets, and computers to shrink in size while adding features.
Conventional integrated circuit manufacturing typically begins with the production of silicon wafers on which the circuitry will be fabricated. An ingot of pure silicon is typically cut into thin slices, called wafers, which serve as the base on which microelectronic circuits are built. These circuits are separated by a process known as dicing. Once separated, they are packaged into individual components and solder wires are applied to the package.
Wafer-level packaging differs from conventional manufacturing in the way the packaging is applied. Instead of separating circuits and then applying encapsulation and leads before proceeding with testing, this technique is used to integrate multiple steps. The top and bottom of the package and the solder leads are applied to each IC before the wafer is cut. The test is also normally carried out before the wafer is cut.
Like many other types of common component packages, ICs made with wafer-level packages are a type of surface-mount technology. Surface mount devices are applied directly to the surface of a circuit board, melting solder balls attached to the component. Wafer level components can be used in a similar way to other surface mount devices. For example, they can often be purchased on reels of tape for use in automated component placement systems known as pick and place machines.
A number of economic benefits can be achieved by implementing wafer-level packaging. It enables the integration of wafer manufacturing, packaging, and testing, streamlining the manufacturing process. Reducing manufacturing cycle time increases production throughput and lowers the cost per unit manufactured.
Wafer-level packaging also allows for reduced package size, saving material and further reducing production costs. More importantly, however, the small package size allows the components to be used in a wide variety of advanced products. The need for smaller component size, especially reduced package height, is one of the key market drivers for wafer-level packaging.
Components made with wafer-level packaging are widely used in consumer electronics such as cell phones. This is largely due to market demand for smaller, lighter electronic devices that can be used in increasingly complex ways. For example, many cell phones are used for a variety of functions beyond a simple call, such as taking photos or recording videos. Wafer-level packaging has also been used in a variety of other applications. For example, they are used in automobile tire pressure monitoring systems, implantable medical devices, military data transmission systems, and more.